Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, ...

Many applications require joining metals to ceramics, such as sealing electrodes to glass enclosures for light bulbs. Such joints need to provide continuous chemical contact across the interface ...

SAN JOSE, Calif. – There is a sea of change taking place in one segment of IC packaging, a move that will dramatically reduce assembly costs and possibly chip prices. It could also possibly enable ...

Author’s Note: The 2023 NEC contains significant changes to Art. 680 Swimming Pools, Fountains, and Similar Installations. These changes incorporated public input and comments submitted during the ...

Article 250 of the National Electrical Code (NEC) focuses on grounding and bonding. This Code Article is divided into 10 separate parts — each identified by a Roman numeral. Because of the terminology ...